3x3 mm2 active area SiPM in Chip Scale Package (CSP) of plastic material. The detector is completely covered with transparent epoxy layer.
Compatible with surface mounting technology reflow process.
Available in RGB-SiPM technology (visible light detection) and NUV-SiPM technology (near ultra violet light detection).
Slim CSP design: Edgeless SiPM dies and tight package to minimize inactive area. 200 µm frame around SiPM active area on three sides
Upon request, CSP SiPMs are provided already mounted on AdvanSiD Sockets (SMT to pin conversion).
DCR: Dark Count Rate
PDE: Photo Detection Efficiency
|3x3 mm2 NUV-SiPM in CSP||»||ASD-NUV3S-P|
|3x3 mm2 RGB-SiPM in CSP||»||ASD-RGB3S-P|